Effect of wire purity on copper wire bonding

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 755-759

  Srikanth, Narasimalu ^a   Premkumar, J ^a   Sivakumar, M ^a   Wong, Y M ^a   Vath III, C J ^a  

^a Research and Development Department   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ALUMINUM CLADDING; COPPER; ELECTRONICS PACKAGING; LIGHT METALS; TECHNOLOGY; WIRE; YIELD STRESS;

BOND PADS; COPPER WIRES; IC PACKAGING; METALLIZATION; PACKAGING TECHNOLOGIES; REDUCED ENERGY; WIRE BONDERS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049086962     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469764     Document Type: Conference Paper

References (12)

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