Part II: Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding of 6-mil-diameter wire

Materials Characterization

Volumn 54, Issue 1, 2005, Pages 93-95

  Murali, S ^a   Srikanth, N ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; MICROHARDNESS; MICROSTRUCTURE; OXIDATION; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; VELOCITY MEASUREMENT; WIRE;

COPPER BALL BONDING; FIRE AIR BALL (FAB); HEAT-AFFECTED ZONE (HAZ); THERMOSONIC BONDING;

COPPER;

EID: 13244268518     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.11.007     Document Type: Article

References (1)

1. S. Murali, N. Srikanth, and Charles Vath III Grains, deformation substructures and slip bands observed in thermosonic copper ball bonding Mater. Charact. 50 2003 39 50