Micromachining of electroformed nickel mold using thick photoresist microstructure for imprint technology

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1359-1365

  Shibata, Takayuki ^a   Takahashi, Yoichi ^a   Kawashima, Takahiro ^a   Kubota, Toshio ^b   Mita, Mamoru ^c   Mineta, Takashi ^d   Makino, Eiji ^d  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b IBARAKI UNIVERSITY   (Japan)

^c MEPJ Co Ltd   (Japan)

^d HIROSAKI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTROCHEMISTRY; ELECTROFORMING; ELECTROPLATING; FORMING; LITHOGRAPHY; MERCURY (METAL); METALLIZING; MICROCRYSTALLINE SILICON; MICROSTRUCTURE; MOLDS; MOLECULAR BEAM EPITAXY; NICKEL; NICKEL ALLOYS; NONMETALS; OPTICAL DESIGN; PHOTORESISTORS; SILICON; SURFACE TREATMENT; TECHNOLOGY; THICKNESS MEASUREMENT;

CONVENTIONAL PHOTOLITHOGRAPHY; EDGE QUALITY; ELECTROFORMED NICKEL; FEATURE SIZES; FINE PATTERNED; GEOMETRICAL DIMENSIONS; HIGH-PRESSURE MERCURY LAMP; IMPRINT TECHNOLOGY; PHOTO MASKING; POLYMER-BASED MICROSTRUCTURES; REPLICATION MASTER; SIDE-WALL-ANGLE; SILICON SUBSTRATES; SINGLE-WAVELENGTH; THICK PHOTORESISTS;

PHOTORESISTS;

EID: 49949102225     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0501-3     Document Type: Conference Paper

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