Electrostatic bonding of a silicon master to a glass wafer for plastic microchannel fabrication

Journal of Materials Processing Technology

Volumn 178, Issue 1-3, 2006, Pages 278-282

  Liu, Jun Shan ^a   Liu, Chong ^a   Guo, Ji Hong ^a   Wang, Li Ding ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Hot embossing; Microchannel; Microfluidics; Plastic; Polymethylmethacrylate (PMMA)

Indexed keywords

MATHEMATICAL MODELS; SILICON; SUBSTRATES; THERMAL EFFECTS;

HOT EMBOSSING; MICROCHANNELS; MICROFLUIDICS; PYREX7740 GLASS;

POLYMETHYL METHACRYLATES;

EID: 33746677423     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.04.009     Document Type: Article

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