-
1
-
-
0037642817
-
Telecommunications applications of MEMS, MSTnews - International news letter on microsystems and MEMS
-
J.A. Walker, Telecommunications applications of MEMS, MSTnews - international news letter on microsystems and MEMS, MEMS 3 (2000) 6-9.
-
(2000)
MEMS
, vol.3
, pp. 6-9
-
-
Walker, J.A.1
-
2
-
-
0035101710
-
MEMS technology for optical networking applications
-
A. Neukermans, and R. Ramaswami MEMS technology for optical networking applications IEEE Commun. Mag. 39 1 2001 62 69
-
(2001)
IEEE Commun. Mag.
, vol.39
, Issue.1
, pp. 62-69
-
-
Neukermans, A.1
Ramaswami, R.2
-
3
-
-
0033080136
-
A variable optical attenuator based on silicon micromechanics
-
C. Marxer, P. Griss, and N. de Rooij A variable optical attenuator based on silicon micromechanics IEEE Photonics Technol. Lett. 11 2 1999 233 235
-
(1999)
IEEE Photonics Technol. Lett.
, vol.11
, Issue.2
, pp. 233-235
-
-
Marxer, C.1
Griss, P.2
De Rooij, N.3
-
4
-
-
0027663986
-
LIGA microstructures on top of micromachined silicon wafers used to fabricated a micro-optical switch
-
A. Müller, J. Göttert, and J. Mohr LIGA microstructures on top of micromachined silicon wafers used to fabricated a micro-optical switch J. Micromech. Microeng. 3 1993 158 160
-
(1993)
J. Micromech. Microeng.
, vol.3
, pp. 158-160
-
-
Müller, A.1
Göttert, J.2
Mohr, J.3
-
5
-
-
0036645839
-
Bulk silicon micromachining for MEMS in optical communication systems
-
M. Hoffmann, and E. Voges Bulk silicon micromachining for MEMS in optical communication systems J. Micromech. Microeng. 12 2002 349 360
-
(2002)
J. Micromech. Microeng.
, vol.12
, pp. 349-360
-
-
Hoffmann, M.1
Voges, E.2
-
6
-
-
0038685055
-
Fibre-optical MEMS switches based on bulk silicon micromachining
-
M. Hoffmann, P. Kopka, D. Nüsse, and E. Voges Fibre-optical MEMS switches based on bulk silicon micromachining Microsyst. Technol. 9 5 2003 299 303
-
(2003)
Microsyst. Technol.
, vol.9
, Issue.5
, pp. 299-303
-
-
Hoffmann, M.1
Kopka, P.2
Nüsse, D.3
Voges, E.4
-
7
-
-
3042774698
-
Development of 1 × 4 MEMS-based optical switch
-
Z.F. Wang, W. Cao, X.C. Shan, J.F. Xu, S.P. Lim, W. Noell, and N.F. de Rooij Development of 1 × 4 MEMS-based optical switch Sens. Actuators A 114 2004 80 87
-
(2004)
Sens. Actuators A
, vol.114
, pp. 80-87
-
-
Wang, Z.F.1
Cao, W.2
Shan, X.C.3
Xu, J.F.4
Lim, S.P.5
Noell, W.6
De Rooij, N.F.7
-
8
-
-
0036502241
-
The Lucent LambdaRouter: MEMS technology of the future here today
-
D.J. Bishop, C.R. Giles, and G.P. Austin The Lucent LambdaRouter: MEMS technology of the future here today IEEE Commun. Mag. 40 3 2002 75 79
-
(2002)
IEEE Commun. Mag.
, vol.40
, Issue.3
, pp. 75-79
-
-
Bishop, D.J.1
Giles, C.R.2
Austin, G.P.3
-
9
-
-
0036502929
-
Digital MEMS for optical switching
-
P.D. Dobbelaere, K. Falta, L. Fan, S. Gloeckner, and S. Patra Digital MEMS for optical switching IEEE Commun. Mag. 40 3 2002 88 95
-
(2002)
IEEE Commun. Mag.
, vol.40
, Issue.3
, pp. 88-95
-
-
Dobbelaere, P.D.1
Falta, K.2
Fan, L.3
Gloeckner, S.4
Patra, S.5
-
10
-
-
0033732466
-
Hot embossing as a method for the fabrication of polymer high aspect ratio structures
-
H. Becker, and U. Heim Hot embossing as a method for the fabrication of polymer high aspect ratio structures Sens. Actuators A 83 2000 130 135
-
(2000)
Sens. Actuators A
, vol.83
, pp. 130-135
-
-
Becker, H.1
Heim, U.2
-
11
-
-
0036614058
-
Imprinting lithography using replicated mold by Ni electroplating
-
Y. Hirai, S. Harada, S. Isaka, M. Kobayashi, and Y. Tanaka Imprinting lithography using replicated mold by Ni electroplating Jpn. J. Appl. Phys. 41 2002 4186 4189
-
(2002)
Jpn. J. Appl. Phys.
, vol.41
, pp. 4186-4189
-
-
Hirai, Y.1
Harada, S.2
Isaka, S.3
Kobayashi, M.4
Tanaka, Y.5
-
12
-
-
0033309865
-
Fabrication of carbon-based field emitters using stamp technology
-
A. Baba, M. Hizukuri, M. Iwamoto, and T. Asano Fabrication of carbon-based field emitters using stamp technology Jpn. J. Appl. Phys. 38 1999 7203 7207
-
(1999)
Jpn. J. Appl. Phys.
, vol.38
, pp. 7203-7207
-
-
Baba, A.1
Hizukuri, M.2
Iwamoto, M.3
Asano, T.4
-
13
-
-
0032681369
-
Silicon as tool material for polymer hot embossing
-
Orlando
-
H. Becker, and U. Heim Silicon as tool material for polymer hot embossing Proceedings of the MEMS'99 Orlando 1999 228 232
-
(1999)
Proceedings of the MEMS'99
, pp. 228-232
-
-
Becker, H.1
Heim, U.2
-
15
-
-
0036532387
-
Microlens array produced using hot embossing process
-
N. Ong, Y. Koh, and Y. Fu Microlens array produced using hot embossing process Microelectron. Eng. 60 2002 365 379
-
(2002)
Microelectron. Eng.
, vol.60
, pp. 365-379
-
-
Ong, N.1
Koh, Y.2
Fu, Y.3
-
16
-
-
0036544032
-
Microplactic embossing process: Experimental and theoretical characterizations
-
X.J. Shen, L.W. Pan, and L. Lin Microplactic embossing process: experimental and theoretical characterizations Sens. Actuators A 97 2002 428 433
-
(2002)
Sens. Actuators A
, vol.97
, pp. 428-433
-
-
Shen, X.J.1
Pan, L.W.2
Lin, L.3
-
17
-
-
0029711908
-
Micromachined silicon structures for single mode passive alignment
-
H. Han, J.E. Schramm, J. Mathews, and R.A. Boudreau Micromachined silicon structures for single mode passive alignment SPIE'96 2691 1996 118 123
-
(1996)
SPIE'96
, vol.2691
, pp. 118-123
-
-
Han, H.1
Schramm, J.E.2
Mathews, J.3
Boudreau, R.A.4
-
18
-
-
17044429621
-
A self-sensitive SFM for nondestructive measurement of tiny vertical surface with restricted access
-
X.C. Shan, R. Maeda, T. Kobayashi, and G.X. Zhang A self-sensitive SFM for nondestructive measurement of tiny vertical surface with restricted access J. Nanotechnol. Precision Eng. 2 2004 32 37
-
(2004)
J. Nanotechnol. Precision Eng.
, vol.2
, pp. 32-37
-
-
Shan, X.C.1
Maeda, R.2
Kobayashi, T.3
Zhang, G.X.4
|