SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 493, Issue 1-2, 2008, Pages 299-304

Environmental influence on interface interactions and adhesion of Au/SiO2

(5) Kennedy, M S a Moody, N R b Adams, D P c Clift, M b Bahr, D F a

a WASHINGTON STATE UNIVERSITY (United States)

b SANDIA NATIONAL LABORATORIES (United States)

c SANDIA NATIONAL LABORATORIES (United States)

Author keywords

Adhesion; Humidity; Interface; Interfacial fracture energy

Indexed keywords

CRACK TIPS; DELAMINATION; GOLD DEPOSITS; HUMIDITY CONTROL;

CONTROLLED HUMIDITIES; ENVIRONMENTAL INFLUENCES; GROWTH MECHANISMS; INTERFACE ADHESION; INTERFACE INTERACTION; INTERFACIAL ADHESION ENERGY; INTERFACIAL CRACKS; INTERFACIAL FRACTURE ENERGY; STRESSED OVERLAYER;

ADHESION;

EID: 49849102974 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2007.09.081 Document Type: Article

Times cited : (9)

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