Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization

Journal of Applied Physics

Volumn 104, Issue 3, 2008, Pages

  Francis, M F ^a   Neurock, M N ^a   Zhou, X W ^b   Quan, J J ^c   Wadley, H N G ^a   Webb, Edmund B ^d  

^a University of Virginia   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c SEAGATE TECHNOLOGY   (United States)

^d SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHIZATION; AMORPHOUS FILMS; AMORPHOUS MATERIALS; COPPER ALLOYS; DYNAMICS; FRICTION; METALLIC FILMS; MOLECULAR DYNAMICS; QUANTUM CHEMISTRY; SEGREGATION (METALLOGRAPHY); STACKING FAULTS; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACE SEGREGATION; SURFACE STRUCTURE; TANTALUM;

111 TEXTURE; ALLOY FILMS; AMORPHOUS STRUCTURES; CU FILM; CU FILMS; GRAIN STRUCTURES; MISFIT DISLOCATIONS; MISFIT STRAINS; MOLECULAR DYNAMICS SIMULATIONS; POLY-CRYSTALLINE; SINGLE-CRYSTALLINE; STACKING FAULTING; STRUCTURE DIFFERENCE; VAPOR MIXTURES;

COPPER;

EID: 49749132528     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2968240     Document Type: Article

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