ESD-protected wideband CMOS LNAs using modified resistive feedback techniques with chip-on-board packaging

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 8, 2008, Pages 1817-1826

  Chang, Tienyu ^a,b,c   Chen, Jinghong ^a,d   Rigge, Lawrence A ^a,e   Lin, Jenshan ^a,b  

^a IEEE

^b J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

^c RF and Mixed Signal Group   (United States)

^d ANALOG DEVICES INC   (United States)

^e INFINEON TECHNOLOGIES   (United States)

Author keywords

CMOS; Electrostatic devices (ESDs); Low noise amplifier (LNA); Multiband receiver; Resistive feedback; Ultra wideband (UWB)

Indexed keywords

AMPLIFIERS (ELECTRONIC); AUDIO FREQUENCY AMPLIFIERS; BROADBAND AMPLIFIERS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROSTATIC DEVICES; ELECTROSTATIC DISCHARGE; HETEROJUNCTION BIPOLAR TRANSISTORS; LOW NOISE AMPLIFIERS; OPTICAL DESIGN; TELECOMMUNICATION SYSTEMS;

BOND-WIRE INDUCTORS; CHIP PERFORMANCE; CHIP-ON-BOARD; CMOS; CMOS TECHNOLOGIES; ELECTROSTATIC DEVICES (ESDS); FEED BACK LOOPS; FEEDBACK NETWORKS; INTERCEPT POINTS; LOW-NOISE AMPLIFIER (LNA); MINIMUM NOISE FIGURE; MULTIBAND RECEIVER; POWER CONSUMPTIONS; POWER GAINS; RESISTIVE FEEDBACK; SOURCE FOLLOWERS; THIRD-ORDER INTERMODULATION; ULTRA-WIDEBAND (UWB); WIDE BANDS;

ELECTRONICS PACKAGING;

EID: 49249095722     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.927301     Document Type: Article

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