Temperature study of sub-micrometric ICs by scanning thermal microscopy

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 3, 2007, Pages 424-431

  Gomés, Séverine ^a,b   Chapuis, Pierre Olivier ^b   Nepveu, F ^b   Trannoy, N ^b   Volz, S ^b   Charlot, B ^b   Tessier, G ^b   Dilhaire, S ^b   Cretin, B ^b   Vairac, P ^b  

^a UNIVERSITÉ DE LYON   (France)

^b Groupement de Recherche Micro et Nanothermique   (France)

Author keywords

Integrated circuits (ICs) temperature measurement; Scanning thermal microscope (SThM) technique; Spatial resolution; SPM thermoresistive wire probe

Indexed keywords

IMAGE RESOLUTION; INTEGRATED CIRCUITS; PASSIVATION; PROBES; SCANNING; SIGNAL TO NOISE RATIO; TEMPERATURE MEASUREMENT; TIMING CIRCUITS;

INTEGRATED CIRCUITS (ICS); PASSIVATION LAYER; SCANNING THERMAL MICROSCOPE; SCANNING THERMAL MICROSCOPY; SPATIAL RESOLUTION; SURFACE TEMPERATURE MEASUREMENT; TEMPERATURE STUDY; THERMO-RESISTIVE;

THORIUM COMPOUNDS;

EID: 49149094516     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.901748     Document Type: Article

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