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Volumn , Issue , 2007, Pages 1661-1664
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Material properties measurement and numerical simulation for characterization of ultra-low-power consumption hotplates
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Author keywords
FEM modeling; Hotplate; Power consumption; Thermal conductivity
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Indexed keywords
ACTUATORS;
ATMOSPHERIC PRESSURE;
ATMOSPHERICS;
COMPUTER SIMULATION;
ELECTRIC POWER UTILIZATION;
FINITE ELEMENT METHOD;
MICROSYSTEMS;
SENSORS;
THERMODYNAMIC PROPERTIES;
THICK FILMS;
THREE DIMENSIONAL;
TRANSDUCERS;
3-D MODELING;
EXPERIMENTAL CURVES;
FEM MODELING;
FINITE ELEMENTS;
HEATING POWER;
HOT-PLATES;
HOTPLATE;
INTERNATIONAL CONFERENCES;
MATE RIAL PROPERTIES;
NUMERICAL SIMULATIONS;
ON CHIPS;
POWER CONSUMPTION;
SIMULATED RESULTS;
SOLID-STATE SENSORS;
SUSPENDED STRUCTURES;
TEST STRUCTURES;
THERMAL CONDUCTIVITY;
THERMAL PROPERTIES;
THIN FILMS;
ULTRA-LOW-POWER;
VACUUM CHAMBERS;
MODEL STRUCTURES;
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EID: 48349113885
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SENSOR.2007.4300469 Document Type: Conference Paper |
Times cited : (9)
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References (7)
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