Wafer-level testing of thermopile IR detectors

Proceedings of IEEE Sensors

Volumn 2005, Issue , 2005, Pages 1133-1136

  Mancarella, Fulvio ^a   Roncaglia, Alberto ^a   Passini, Mara ^a   Sanmartin, Michele ^a   Cardinali, Gian Carlo ^a   Severi, Maurizio ^a  

^a CNR Consiglio Nazionale delle Ricerche   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC VARIABLES MEASUREMENT; ELECTRONIC EQUIPMENT TESTING; FINITE ELEMENT METHOD; OPTICAL VARIABLES MEASUREMENT; THERMOPILES;

FINITE ELEMENT MODELS; FINITE ELEMENT SIMULATIONS; WAFER LEVEL TESTING;

INFRARED DETECTORS;

EID: 33847310468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2005.1597904     Document Type: Conference Paper

References (2)

1. A. Schaufelbühl, N. Schneeberger, U. Munch et al., Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array, Journal of Microelectromechanical Systems, 10 (2001), pp. 503-510.
2. A. Roncaglia, F. Mancarella, G. C. Cardinali, F. Tamarri, M. Severi, A CMOS-compatible process for thermopiles with high sensitivity in the 3-5 μm atmospheric window, Eurosensors XIX Proceedings, Barcelona, Spain, Sept. 11-14, 2005, p. MC13.