Intermetallic compound formation of Sn/Pb, Sn/Ag, and Sn solders on Ni substrate from the molten stage and its growth during aging

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1347-1355

  Pan, Tsung Yu ^a   Blair, Howard D ^a   Nicholson, John M ^a   Oh, Sung Won ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000019775     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (54)

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