Relationship between crystalline structure and hardness of Ti-Si-N-O coatings fabricated by dc sputtering

Journal of Materials Engineering and Performance

Volumn 17, Issue 4, 2008, Pages 580-585

  García González, Leandro ^a   Hernández Torres, Julián ^b   Mendoza Barrera, Claudia ^a   Meléndez Lira, Miguel ^c   García Ramírez, Pedro J ^a   Martínez Castillo, Jaime ^a   Sauceda, Ángel ^a   Herrera May, Agustin L ^a   Saldaña, Juan Muñoz ^c   Espinoza Beltrán, Francisco J ^c  

^a UNIVERSIDAD VERACRUZANA   (Mexico)

^b UNIVERSIDAD DEL PAPALOAPAN   (Mexico)

^c DEPARTAMENTO DE FÍSICA   (Mexico)

Author keywords

Crystalline; Hardness; TiSiNO; XRD

Indexed keywords

AISI D2; AREA RATIOS; ARGON FLOW; CHEMICAL COMPOSITIONS; CRYSTALLINE STRUCTURES; DC SPUTTERING; ELASTIC RECOVERY; HARDNESS TESTS; NANOINDENTATION TESTING; REACTIVE ATMOSPHERES; REACTIVE MAGNETRON CO-SPUTTERING; SILICON (111) SUBSTRATES; STRUCTURAL CHANGES; SUBSTRATE TEMPERATURE (ST); TI-SI-N; X RAY DIFFRACTION (XRD); X-RAY ENERGY DISPERSIVE SPECTROSCOPY (XEDS); YOUNG'S MODULUS (IGC: E14/K14);

ARGON; COATINGS; CRYSTALLINE MATERIALS; HARDNESS; HARDNESS TESTING; INERT GASES; IRON; LITHOGRAPHY; MAGNETRON SPUTTERING; NITROGEN; NONMETALS; OPTICAL DESIGN; REACTIVE SPUTTERING; SOLID SOLUTIONS; SPUTTER DEPOSITION; STOICHIOMETRY; SUBSTRATES; TESTING; TITANIUM; TITANIUM COMPOUNDS; TOOL STEEL;

SILICON;

EID: 47249123028     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-007-9141-0     Document Type: Article

References (19)

1. 4 on SKD 11 Steel by Sputtering, J. Mater. Process. Technol., 130-131, 2002, p 283-288, in English
2. H. Watanabe, Y. Sato, Ch. Nie, A. Ando, S. Ohtani, N. Iwamoto, The Mechanical Properties and Microstructure of Ti-Si-N Nanocomposite Coatings by Ion Plating, Surf. Coat. Technol., 169-170, 2003, p 452-455, in English
3. J.S. Reid, E. Kolawa, C.M. Garland, M.-A. Nicolet, F. Cardone, D. Gupta, R.P. Ruiz, Amorphous (Mo, Ta, or W)-Si-N Diffusion Barriers for Al Metallizations, J. Appl. Phys., 79(2), 1996, p 1109-1115, in English
4. x /Si System, Appl. Surf. Sci., 117-118, 1997, p 312-316, in English
5. F. Letendu, M.C. Hugon, B. Agius, I. Vickridge, C. Berthier, J.M. Lameille, TaSiN Diffusion Barriers Deposited by Reactive Magnetron Sputtering, Thin Solid Films, 513(1-2), 2006, p 118-124, in English
6. Y.-J. Lee, B.-S. Suh, M.-S. Kwon, C.-O. Park, Barrier Properties and Failure Mechanism of Ta-Si-N Thin films for Cu Interconnection, J. Appl. Phys., 85(3), 1999, p 1927-1934, in English
7. 4 Treatments of CVD TiN Barrier Layers, Microelectron. Eng., 82(3-4), 2005, p 618-622, in English
8. H.-E. Cheng, W.-J. Lee, C.-M. Hsu, The Effect of Deposition Temperature on the Properties of TiN Diffusion Barriers Prepared by Atomic Layer Chemical Vapor Deposition, Thin Solid Films, 485(1-2), 2005, p 59-65, in English
9. 4 Composites, J. Eur. Ceram. Soc., 24(2), 2004, p 381-386, in English
10. 4 Nanocomposites, Mater. Sci. Eng. A, 2004, 384(1-2), p 102-116, in English
11. Si < 30 at.%), Thin Solid Films, 339(1-2), 1999, p 129-136, in English
12. Y.C. Ee, Z. Chen, T.M. Lu, Z.L. Dong, S.B. Law, Low Temperature Physical-Chemical Vapor Deposition of Ti-Si-N-O Barrier Films, Electrochem. Solid-State Lett., 9(3), 2006, p G100-G103, in English
13. P.M. Smith, J.S. Custer, Chemical Vapor Deposition of Titanium-Silicon-Nitride Films, Appl. Phys. Lett., 70(23), 1997, p 3116-3118, in English
14. Y.C. Ee, Z. Chen, S.B. Law, S. Xu, Formation and Characterization of Ti-Si-N-O Barrier Films, Thin Solid Films, 504(1-2), 2006, p 218-222, in English
15. A.M. Korsunsky, M.R. McGurk, S.J. Bull, T.F. Page, On the Hardness of Coated System, Surf. Coat. Technol., 99 (1-2), 1998, p 171-183, in English
16. M. McKeehan, B.E. Warren, X-Ray Study of Cold Work in Thoriated Tungsten, J. Appl. Phys., 24(1), 1953, p 52-56, in English
17. C. Louro, A. Cavaleiro, Mechanical Behaviour of Amorphous W-Si-N Sputtered Films After Thermal Annealing at Increasing Temperatures, Surf. Coat. Technol., 123(2-3), 2000, p 192-198, in English
18. S. Vepřek, S. Reiprich, A Concept for the Design of Novel Superhard Coatings, Thin Solid Films, 268(1-2), 1995, p 64-71, in English
19. J.R. Tuck, A.M. Korsunsky, R.I. Davidson, S.J. Bull, D.M. Elliott, Modelling of the Hardness of Electroplated Nickel Coatings on Copper Substrates, Surf. Coat. Technol., 127, 2000, p 1-8, in English