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Volumn 85, Issue 2, 2008, Pages 477-485

A modified 4-point bend delamination test

Author keywords

Delamination; Fatigue crack growth; Fracture toughness; Thin film

Indexed keywords

CRACK PROPAGATION; CRACKING (CHEMICAL); DELAMINATION; ENERGY RELEASE RATE; FATIGUE CRACK PROPAGATION; FATIGUE TESTING; FIXTURES (TOOLING); STEEL SHEET; TESTING; THICK FILMS;

EID: 47049103030     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.08.010     Document Type: Article
Times cited : (30)

References (16)
  • 4
    • 0029502626 scopus 로고    scopus 로고
    • Q. Ma, H. Fujimoto, P. Flinn, V. Jain, F. Adibi-rizi, F. Moghadam, R.H. Dauskardt, in: A.S. Oates, W.F. Filter, R. Rosenberg, A.L. Greer, K. Gadepally (Eds.), Materials Reliability in Microelectronics V, vol. 391, San Francisco, USA., April 17-21, 1995, Materials Research Society Symposium Proceedings, 1995, p. 91.
    • Q. Ma, H. Fujimoto, P. Flinn, V. Jain, F. Adibi-rizi, F. Moghadam, R.H. Dauskardt, in: A.S. Oates, W.F. Filter, R. Rosenberg, A.L. Greer, K. Gadepally (Eds.), Materials Reliability in Microelectronics V, vol. 391, San Francisco, USA., April 17-21, 1995, Materials Research Society Symposium Proceedings, 1995, p. 91.
  • 5
    • 0031384881 scopus 로고    scopus 로고
    • Q. Ma, J. Bumgarner, H. Fujimoto, M. Lane, R.H. Dauskardt, in: J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez, Z.G. Suo (Eds.), Materials Reliability in Microelectronics VII, vol. 473, San Francisco, USA, March 31-April 3, 1997, Materials Research Society Symposium Proceedings, 1997, p. 3.
    • Q. Ma, J. Bumgarner, H. Fujimoto, M. Lane, R.H. Dauskardt, in: J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez, Z.G. Suo (Eds.), Materials Reliability in Microelectronics VII, vol. 473, San Francisco, USA, March 31-April 3, 1997, Materials Research Society Symposium Proceedings, 1997, p. 3.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.