Adhesion measurement of interfaces in multilayer interconnect structures

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 3-14

  Ma, Qing ^a   Bumgarner, John ^a   Fujimoto, Harry ^a   Lane, Michael ^a   Dauskardt, Reinhold H ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; CHEMICAL BONDS; DIELECTRIC MATERIALS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; MECHANICAL TESTING; MULTILAYERS; PLASTICITY; SILICA; SURFACE ROUGHNESS; THIN FILMS;

BEND TESTS; MULTILAYER INTERCONNECTS;

INTERFACES (MATERIALS);

EID: 0031384881     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-3     Document Type: Conference Paper

References (14)