Nanomechanical properties and nanostructure of CMG and CMP machined Si substrates

Key Engineering Materials

Volumn 381-382, Issue , 2008, Pages 525-528

  Wang, B L ^a   Huang, H ^a   Zou, J ^a   Zhou, L ^b  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b IBARAKI UNIVERSITY   (Japan)

Author keywords

Acoustic emission; CMG; Grinding; Nanoindentation; Silicon

Indexed keywords

ACOUSTIC EMISSION TESTING; ACOUSTIC EMISSIONS; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; GRINDING (MACHINING); HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOINDENTATION; POLISHING; SILICON;

CHEMICAL MECHANICAL POLISHING(CMP); CHEMO-MECHANICAL-GRINDING; CROSS SECTIONAL TRANSMISSION ELECTRON MICROSCOPY; CRYSTALLINE LAYERS; DIFFRACTION SPOTS; NANOMECHANICAL PROPERTY; SUBSTRATE SURFACE; TRANSMISSION ELECTRON;

SUBSTRATES;

EID: 47049084954     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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