A novel fixed abrasive process: Chemo-mechanical grinding technology

International Journal of Manufacturing Technology and Management

Volumn 7, Issue 5-6, 2005, Pages 441-454

  Zhou, Libo ^a   Shimizu, Jun ^a   Eda, Hiroshi ^a  

^a IBARAKI UNIVERSITY   (Japan)

Author keywords

Additives; Chemo mechanical grinding (CMG); Fixed abrasive process; Free abrasive process; Silicon wafer; Subsurface damage

Indexed keywords

ABRASIVES; CHEMICAL REACTIONS; GRINDING WHEELS; WSI CIRCUITS;

ABRASIVE PROCESS; CHEMO-MECHANICAL-GRINDING; SUBSURFACES DAMAGES; WAFER SIZES;

GRINDING MACHINES;

EID: 28844442907     PISSN: 13682148     EISSN: None     Source Type: Journal    
DOI: 10.1504/IJMTM.2005.007696     Document Type: Article

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