Surface modifications of aluminum alloy 5052 for bipolar plates using an electroless deposition process

Journal of Power Sources

Volumn 183, Issue 1, 2008, Pages 174-181

  Bai, Ching Yuan ^a   Chou, Yu Hsien ^a   Chao, Chu Lung ^a   Lee, Shuo Jen ^b   Ger, Ming Der ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

Corrosion resistance; Electroless deposition; Ni Mo P alloys; Thermal stability

Indexed keywords

ALKALI METALS; ALUMINUM; ALUMINUM ALLOYS; ALUMINUM METALLOGRAPHY; ALUMINUM METALLURGY; CARBON; DIRECT ENERGY CONVERSION; ELECTRIC BATTERIES; ELECTROLESS PLATING; FUEL CELLS; GRAPHITE; LIGHT METALS; MOLYBDENUM; NICKEL; PLATES (STRUCTURAL COMPONENTS); SODIUM;

(1 1 0) SURFACE; (8 HYDROXY QUINOLINE) ALUMINUM; AL(GA) ALLOYS; BIPOLAR PLATES; ELECTROLESS DEPOSITION PROCESS; GRAPHITE BIPOLAR PLATES; P H VALUES; SODIUM MOLYBDATE; SURFACE CHARACTERISTICS; SURFACE MODIFICATIONS;

ALLOYS;

EID: 46949084964     PISSN: 03787753     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jpowsour.2008.04.082     Document Type: Article

References (27)

1. Steele B.C.H., and Heinzel A. Nature 414 (2001) 345-352
2. Borup R.L., and Vanderborgh N.E. Mater. Res. Soc. Symp. Proc. 393 (1995) 151-155
3. Hermann A., Chaudhuri T., and Spagnol P. Int. J. Hydrogen Energy 30 (2005) 1297-1302
4. Oh M.H., Yoon Y.S., and Park S.G. Electrochim. Acta 50 (2004) 777-780
5. Tawfika H., Hung Y., and Mahajan D. J. Power Sources 163 (2007) 755-767
6. Tsuchiya H., and Kobayashi O. Int. J. Hydrogen Energy 29 (2004) 985-990
7. Hodgson D.R., May B., Adcock P.L., and Davies D.P. J. Power Sources 96 (2001) 233-235
8. Davis D.P., Adcock P.L., Turpin M., and Rowen S.J. J. Power Sources 86 (2000) 237-242
9. Wind J., Späh R., Kaiser W., and Böhm G. J. Power Sources 105 (2002) 256-260
10. Jayaraj J., Kim Y.C., Kim K.B., Seok H.K., and Fleury E. Sci. Technol. Adv. Mater. 6 (2005) 282-289
11. Lee S.J., Huang C.H., Chen Y.P., and Chen Y.M. J. Fuel Cell Sci. Technol. 2 (2005) 208-212
12. Wang H., and Turner J.A. J. Power Sources 128 (2004) 193-200
13. Fleury E., Jayaraj J., Kim Y.C., Seok H.K., Kim K.Y., and Kim K.B. J. Power Sources 159 (2006) 34-37
14. Schultze J.W., and Bressel A. Electrochem. Acta 47 (2001) 3-21
15. Homma T., Komatsu I., Ttamaki A., Nakai H., and Osaka T. Electrochem. Acta 47 (2001) 47-53
16. Furukawa S., and Mehregany M. Sens. Actuators A 56 (1996) 261-266
17. Takano N., Hosoda N., Yamada T., and Osaka T. J. Electrochem. Soc. 146 (1999) 1407-1411
18. Wu Y., Wan C.C., and Wang Y.Y. J. Electron. Mater. 34 (2005) 541-550
19. Lu G., and Zangari G. J. Electrochem. Soc. 150 (2003) C777-C786
20. Wang Y., and Northwood D.O. J. Power Sources 165 (2007) 293-298
21. Fu Y., Hou M., Lin G., Hou J., Shao Z., and Yi B. J. Power Sources 176 (2008) 282-286
22. Kohn A., Eizenberg M., and Shacham-Diamand Y. J. Appl. Phys. 94 (2003) 3810-3822
23. Gao Y., Zheng Z.J., Zhu M., and Luo C.P. Mater. Sci. Eng. A 381 (2004) 98-103
24. Lee S.J., Huang C.H., and Chen Y.P. J. Mater. Process. Technol. 140 (2003) 688-693
25. Lou H., Zhu S., and Wang F. Oxid. Met. 43 (1995) 317-328
26. Nicolet M.A. Thin Solid Films 52 (1978) 415-443
27. Chou Y.H., Sung Y., Ou K.L., Liu Y.M., and Ger M.D. Electrochem. Solid-State Lett. 11 (2008) D30-D33