Metallic wafer and chip bonding for LED packaging

Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest

Volumn 1, Issue , 2003, Pages 26-

  Hsu, C C ^a   Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; LIGHT EMITTING DIODES; METAL CLADDING; NANOSTRUCTURES; PHOTONICS; SILICON WAFERS; TEMPERATURE;

CHIP BONDING; CU COATINGS; GAN ON SI; HIGH TEMPERATURE; LED PACKAGING; LIGHTING EFFICIENCY; LOW- TEMPERATURE PROCESS; THERMAL DISSIPATION;

WAFER BONDING;

EID: 33845574315     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CLEOPR.2003.1274506     Document Type: Conference Paper

References (0)