Alternative process schemes for double patterning that eliminate the intermediate etch step

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6924, Issue , 2008, Pages

  Maenhoudt, M ^a   Gronheid, R ^a   Stepanenko, N ^b   Matsuda, T ^c   Vangoidenshoven, D ^a  

^a IMEC   (Belgium)

^b QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

^c PANASONIC CORPORATION   (Japan)

Author keywords

32nm node; Alternative process flows; Double exposure; Double patterning; Dual development; Freezing; Novel materials

Indexed keywords

CLADDING (COATING); FREEZING; PIGMENTS;

(E ,3E) PROCESS; COST OF OWNERSHIP (COO); DENSE PATTERNS; DOUBLE PATTERNING; MEMORY APPLICATIONS; OPTICAL MICRO LITHOGRAPHY; PROCESS FLOWS; PROCESS SCHEMES; PROOF-OF-CONCEPT (POC); SINGLE EXPOSURE; TIME CONSUMING;

LITHOGRAPHY;

EID: 45449094183     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.771884     Document Type: Conference Paper

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