Thermomechanical behavior of organic and ceramic flip chip BGA packages under power cycling

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 214-222

  Park, S B ^a   Joshi, Rahul ^a   Sammakia, Bahgat ^a  

^a State University of New York   (United States)

Author keywords

ATC; CBGA; CFD; FEA; Flip Chip PBGA; Moir Interferometry; Power Cycling

Indexed keywords

ATC; CBGA; FLIP CHIP PBGA; MOIRÉ INTERFEROMETRY; POWER CYCLING;

CERAMIC MATERIALS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; POWER ELECTRONICS; THERMAL CYCLING; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

MICROPROCESSOR CHIPS;

EID: 28144458344     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2005.1412182     Document Type: Conference Paper

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