A class of ceramic-based chip inductors for hybrid integration in power supplies

IEEE Transactions on Power Electronics

Volumn 23, Issue 3, 2008, Pages 1556-1564

  Lim, Michele H ^a   van Wyk, Jacobus D ^a,b   Lee, F C ^a   Ngo, Khai D T ^a  

^a State University   (United States)

^b UNIVERSITY OF JOHANNESBURG   (South Africa)

Author keywords

Conductor; Core; Distributed air gap; Geometry; Low temperature co fired ceramics (LTCC); Parallel conductors; Planar integration; Variable inductance

Indexed keywords

CERAMIC MATERIALS; ELECTRIC CURRENTS; ELECTRIC POWER SYSTEMS; INTEGRATION; POWER ELECTRONICS;

DISTRIBUTED AIR-GAP; HYBRID INTEGRATION; LOW-TEMPERATURE CO-FIRED CERAMICS (LTCC) TECHNOLOGY; PARALLEL CONDUCTORS; PLANAR INTEGRATION; VARIABLE INDUCTANCE;

ELECTRIC INDUCTORS;

EID: 44449085777     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2008.921180     Document Type: Article

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