Low profile integratable inductor fabricated based on LTCC technology for microprocessor power delivery applications

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 1, 2007, Pages 170-177

  Lim, Michele Hui Fern ^a   Liang, Zhenxian ^a,b   van Wyk, Jacobus Daniel ^a,c  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b GE GLOBAL RESEARCH   (United States)

^c UNIVERSITY OF JOHANNESBURG   (South Africa)

Author keywords

Inductor; Low temperature co fired ceramics (LTCC); Power electronics

Indexed keywords

ELECTRIC CONVERTERS; ELECTRIC CURRENTS; ELECTRIC INDUCTORS; MAGNETIC PROPERTIES; MICROPROCESSOR CHIPS; SWITCHING FREQUENCY;

LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); MAGNETIC CHARACTERIZATION; MICROPROCESSOR POWER DELIVERY APPLICATIONS; SMALL SIGNAL MEASUREMENT;

POWER ELECTRONICS;

EID: 34147157679     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.892099     Document Type: Article

References (26)

1. S. Norlyng, "An overview of integrated component technologies," Adv. Microelectron., vol. 30, pt. 3, pp. 9-13, May/Jun. 2003.
2. M. Duffy, S. O'Reilly, T. O'Donnell, and S. C. O. Mathuna, "Analysis of the performance of integrated inductors (fabricated in MCM-L) technology) in RF amplifier applications," in Proc. Electron. Comp. Technol. Conf., 1999, p. 668.
3. J. Zhou, J. D. Myers, and J. J. Felten, "Embedded passives technology for PCBs: Materials, design, and process," NEMI Proj., pp. 1-6, May 2002.
4. E. Waffenschmidt and J. A. Ferreira, "Embedded passives integrated circuits for power converters," in Proc. IEEE 33th Annu. Power Electron. Spec. Conf., 2002, p. 12.
5. L. Daniel, C. R. Sullivan, and S. R. Sanders, "Design of microfabricated inductors," IEEE Trans. Power Electron., vol. 14, no. 4, pp. 709-723, Jul. 1999.
6. M. Brunet, T. O'Donnell, L. Baud, N. Wang, J. O'Brien, P. McCloskey, and S. C. O'Mathuma, "Electrical performance of microtransformers for DC-DC converter applications," IEEE Trans. Magnetics, vol. 38, no. 5, p. 3174, Sep. 2002.
7. C. H. Ahn and M. G. Allen, "Micromachined planar inductors on silicon wafers for MEMS applications," IEEE Trans. Ind. Electron., vol. 45, no. 6, pp. 866-876, Dec. 1998.
8. S. Musunuri, P. L. Chapman, J. Zou, and C. Liu, "Design Issues for Monolithic DC-DC converters," IEEE Trans. Power Electron., vol. 20, no. 3, pp. 639-649, May 2005.
9. J. A. Ferreira and J. D. van Wyk, "Electromagnetic energy propagation in power electronic converters: Toward future electromagnetic integration," Proc. IEEE, vol. 89, no. 6, pp. 876-888, Jun. 2001.
10. K. H. Kim, J. Kim, H. J. Kim, S. H. Han, and H. J. Kim, "A megahertz switching DC/DC converter using FeBN thin film inductor," IEEE Trans. Magnetics, vol. 38, no. 5, pt. 1, pp. 3162-3164, Sep. 2002.
11. S. Prabhakaran, C. R. Sullivan, T. O'Donnell, M. Brunet, and S. Roy, "Microfabricated coupled inductors for DC-DC converters for micro-processor power delivery," in Proc. IEEE 35th Annu. Power Electron. Spec. Conf., Jun. 2004, vol. 6, no. 20-25, pp. 4467-4472.
12. J. D. van Wyk, Jr., W. A. Cronje, and J. D. van Wyk, "Converter layout parasitic extraction and modeling-continuation of a systematic approach," in Proc. IEEE Ind. Appl. Conf., Oct. 1999, vol. 2, no. 3-7, pp. 1445-1452.
13. M. J. Prieto, A. M. Pernia, J. M. Lopera, J. A. Martin, and F. Nuno, "Design and analysis of thick-film integrated inductors for power converters," IEEE Trans. Ind. Appl., vol. 38, no. 2, pp. 543-552, Mar./Apr. 2002.
14. S. M. Jenei, O. S. Aleksic, and L. D. Zivanov, "Modeling and optimization of multilayer thick film inductors," in Proc. 21st Int. Conf. Microelectron., 1997, vol. 1, pp. 417-420.
15. F. Lautzenhiser, W. Zhang, and S. Shahbazi, "Production development of zero-shrink LTCC material system," in Proc. 37th Int. Symp. Microelectron., 2004, [CD ROM].
16. R. Perrone, H. Thust, and K. Drue, "Progress in the integration ofplanar and 3D Coils on LTCC by using photoimageable Inks," Adv. Microelectron., vol. 32, no. 2, pp. 6-9, Mar./Apr. 2005.
17. K. M. Chua, P. Arulvanan, W. Fan, V. Sunappan, and S. C. K. Wong, "Process issues and effect of process variables on electrical and mechanical properties of co-fired LTCC substrates," in Proc. 37th Int. Symp. Microelectron., 2004, [CD ROM].
18. P. J. Ollivier and M. Rine, "Material and process development for plateable conductors on LTCC," in Proc. 37th Int. Symp. Microelectron., 2004, [CD ROM].
19. Thick-Film Materials and Ceramic Tapes from ESL ElectroScience, ISO 9001:2000 [Online].HAvailable: http://www.electroscience.com
20. S. Jing and Q. Jiang, "An alternative method to determine the initial permeability of ferrite core using network analyzer," IEEE Trans. Electromag. Compat., vol. 38, no. 2, pp. 651-657, Aug. 2005.
21. "Agilent 16454A Magnetic Material Test Fixture Operation and Service Manual," Agilent Technologies, 2007.
22. E. Salahun, P. Queffelec, M. Le Floc'h, and P. Gelin, "A broadband permeameter for "in situ" measurements of rectangular samples," IEEE. Trans. Magn., vol. 37, no. 4, pt. 1, pp. 2743-2745, Jul. 2001.
23. V. Korenivski, R. B. van Dover, P. M. Mankiewich, Z.-X. Ma, A. J. Becker, P. A. Polakos, and V. J. Fratello, "A method to measure the complex permeability of thin films at ultra-high frequencies," IEEE. Trans. Magn., vol. 32, no. 5, pt. 2, pp. 4905-4907, Sep. 1996.
24. C. A. Grimes, P. L. Trouilloud, and R. M. Walser, "A new swept-frequency permeameter for measuring the complex permeability of thin magnetic films," IEEE. Trans. Magn., vol. 24, no. 1, pp. 603-610, Jan. 1988.
25. Power Electronic Measurements, Ltd., "Rogowski coil," Tech. Rep., 2007 [Online]. Available: http://www.pemuk.com/
26. Cooper Electronic Technologies, "Flat Pac low profile inductor," Tech. Rep., Cooper Bussmann, 2007 [Online]. Available: http://www.cooperet.com/