Design method and material technologies for passives in printed circuit board embedded circuits

IEEE Transactions on Power Electronics

Volumn 20, Issue 3, 2005, Pages 576-584

  Waffenschmidt, Eberhard ^a   Ackermann, Bernd ^a   Ferreira, J A ^b  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b Delft Technical University ^*  (Netherlands)

Author keywords

Embedded passives integrated circuits (emPic); Printed circuit board (PCB)

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MAGNETIC DEVICES; MAGNETIC FLUX; PASSIVE NETWORKS; POWER CONVERTERS; POWER INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS;

EMBEDDED PASSIVES INTEGRATED CIRCUITS; MATERIAL TECHNOLOGIES;

POWER ELECTRONICS;

EID: 19144367704     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2005.846530     Document Type: Article

References (13)

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