High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90nm RF-CMOS 5GHz VCO

35th European Microwave Conference 2005 - Conference Proceedings

Volumn 1, Issue , 2005, Pages 77-80

  Sun, X ^a   Linten, D ^a,b   Dupuis, O ^a   Carchon, G ^a   Soussan, P ^a   Decoutere, S ^a   De Raedt, W ^a  

^a IMEC   (Belgium)

^b VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CONSUMPTION; PHASE NOISE; RF-CIRCUITS; WAFER-LEVEL PACKAGING (WLP);

ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; POLYSILICON; Q FACTOR MEASUREMENT; VARIABLE FREQUENCY OSCILLATORS; WSI CIRCUITS;

CMOS INTEGRATED CIRCUITS;

EID: 33846632172     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2005.1608797     Document Type: Conference Paper

References (10)

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