An analysis of two-heater active thermal control technology for device class testing

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 577-584

  Wan, J W ^a,b   Zhang, W J ^a   Torvi, David ^a   Wu, F X ^a  

^a UNIVERSITY OF SASKATCHEWAN   (Canada)

^b GUANGZHOU UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY;

ACTIVE THERMAL CONTROL; CRITICAL HEATER POWER; DIE TEMPERATURE RISE; MAXIMUM DEVICE POWER; THERMAL TESTING; TWO HEATER ACTIVE THERMAL CONTROL SYSTEM;

INTEGRATED CIRCUIT TESTING;

EID: 4444319354     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831820     Document Type: Article

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