Active thermal control of distributed parameter systems with application to testing of packaged IC devices

Journal of Heat Transfer

Volumn 125, Issue 1, 2003, Pages 164-174

  Sweetland, Matthew ^a   Lienhard, John H ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

Conduction; Control; Electronics; Heat transfer; Temperature

Indexed keywords

THERMAL CONTROL;

CAPACITANCE; ELECTRIC RESISTANCE; MICROPROCESSOR CHIPS; TEMPERATURE CONTROL; THERMAL LOAD;

HEAT TRANSFER;

CONDUCTION; CONTROL SYSTEM; ELECTRONIC EQUIPMENT; HEAT TRANSFER;

EID: 0037902403     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1527908     Document Type: Article

References (13)

1. Pfahnl, A. C., Lienhard V. J. H., and Slocum, A. H., 1999, "Thermal Management and Control in Testing Packaged Integrated Circuit Devices," Proc. 34th Intersociety Energy Conversion Conf., Vancouver BC. Paper No. 1999-01-2723.
2. Tadayon, P., 2000, "Thermal Challenges During Microprocessor Testing," Intel Technology Journal, Q3.
3. Kromann, G. B., 1996, "Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola Power PC 603 and PowerPC 604 RISC Microprocessors," Proceedings of the Twelfth IEEE SEMI-THERM Symposium, pp. 36-42.
4. Malinoski, M., Maveety, J., Knostman, S., and Jones, T., 1998, "Test Site Thermal Control System for A1-Speed Manufacturing Testing," Proc. IEEE Intl. Test Conf., Washington, DC, pp. 119-128.
5. Pfahnl, A. C., Lienhard V. J. H., and Slocum, A. H., 1998, "Temperature Control of a Handler Test Interface," Proc. IEEE Intl. Test Conf., Washington, DC, pp. 114-118.
6. Viswanath, R., Wakbarkar, V., Watwe, A., and Lebonheur, V., 2000, "Thermal Performance Challenges From Silicon to Systems," Intel Technology Journal. Q3.
7. Sweetland, M., 2001, "Design of Thermal Control Systems for Testing of Electronics," Ph.D. thesis, Massachusetts Institute of Technology, Cambridge. MA.
8. Tustantswkyj, J., and Babcock, J. B., 1998, "Temperature Control System for an Electronic Device Which Achieves a Quick Response by Interposing a Heater Between the Device and a Heat Sink," U.S. Patent #5.821.505.
9. Tustaniwskyj, J. I., and Babcock, J. W., 1997, "Constant Temperature Control of a Device Under Test (DUT): Part 1, Advances in Electronic Packaging," 2, pp. 2031-2036.
10. Carslaw, H. S., and Jaeger, J. C., 1959, Conduction of Heat in Solids, 2nd edition, Oxford University Press, Oxford.
11. Mills, A. F., 1995, Heat and Mass Transfer, Irwin, Chicago, IL.
12. Robertson, J. S., Bolinger, K., Glasser, L. M., Sloane, N. J. A., and Gross, R., CRC Standard Mathematical Tables and Formulas. Daniel Zwillinger, ed. CRC Press, Boca Raton, Chpt. 1.
13. Aziz, A., and Kraus, A. D., 1995, "Transient Heat Transfer in Extended Surfaces," Appl. Mech. Rev., 48(7), pp. 317-350.