Measurement of the hygroscopic swelling coefficient in mold compounds using Moiré interferometry

Experimental Techniques

Volumn 27, Issue 4, 2003, Pages 40-44

  Stellrecht, E ^a   Han, B ^a   Pecht, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION GRATINGS; FILLERS; MICROPROCESSOR CHIPS; SWELLING; THERMOGRAVIMETRIC ANALYSIS;

HYGROSCOPIC SWELLING; MOIRE INTERFEROMETRY; MOLD COMPOUNDS;

INTERFEROMETRY;

EID: 0042471842     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2003.tb00122.x     Document Type: Article

References (9)

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3. Buchhold, R., Nakladal, A., Gerlach, G., Sahre, K., Eichhorn, K.-J., Herold, M., and Gauglitz, G., "Influence of Moisture Uptake on Mechanical Properties of Polymers Used in Microelectronics," Proceedings of the Low-Dielectric Constant Materials IV, Materials Research Society, Warrendale, PA, pp. 359-364, 1998.
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7. Post D., Han, B. and Ifju P, Chap. 7, "Moiré Methods for Engineering and Science - Moiré Interferometry and Shadow Moiré," Photomechanics for Engineers, Pramod Rastogi, ed., Springer-Verlag, 2000.
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