Fill pattern and particle distribution of underfill material

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 493-498

  Huang, Yue ^a   Bigio, David ^a   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; FILLERS; PARTICLE SIZE ANALYSIS; PRINTED CIRCUIT BOARDS; THERMAL EXPANSION; TRANSFER MOLDING; VISCOSITY;

PARTICLE MIGRATION; PARTICLE SETTLING; UNDERFILL DISPENSING; UNDERFILL VISCOSITY;

FLIP CHIP DEVICES;

EID: 4444233994     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.831776     Document Type: Article

References (15)

1. J. Newbold and A. Lewis, The effects of new trends in flip chip packages on automating the underfill processes, Asymtek, Carlsbad, CA, 1998.
2. Y. Guo, G. L. Lehmann, T. Dricoll, and E. J. Cotts, "A model of the underfill flow process: particle distribution effects," in Proc. Electron. Comp. Technol. Conf., 1999, pp. 71-76.
3. D. K. Shin and J. J. Lee, "Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging," IEEE Trans. Comp., Packa g., Manufact. Technol. B, vol. 21, pp. 413-421, Nov. 1998.
4. H. T. Vo, M. Todd, F. G. Shi, A. A. Shapiro, and M. Edwards, "Toward model-based engineering of underfill materials: CTE modeling," Microelectron. J., vol. 32, no. 4, pp. 331-338, 2001.
5. M. Ranjan, L. Gopalakrishnan, K. Srihari, and C. Woychik, "Die cracking in flip chip assemblies," in Proc. Electron. Comp. Technol. Conf., 1998, pp. 729-7733.
6. L. Gopalakfishnan, M. Ranjan, Y. Sha, K. Srihari, and C. Woychik, "Encapsulant materials for flip chip attach," in Proc. Electron. Comp. Technol. Conf., 1998, pp. 1291-1297.
7. L. Fan, Z. Zhang, and C. P. Wong, "Effect of filler settling of underfill encapsulant on reliability performance," in Proc. Int. Symp. Adv. Packag. Mater., 2001, pp. 218-223.
8. K. Darbha, J. H. Okura, and A. Dasgupta, "Impact of underfill filler particles on reliability of flip-chip interconnects," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 275-280, June 1998.
9. P. Fine, B. Cobb, and L. Nguyen, "Flip chip underfill flow characteristics and prediction," in Proc. 48th Electron. Comp. Technol. Conf., 1999, pp. 790-796.
10. R. J. Phillips and R. C. Armstrong, "A constitutive equation for concentrated suspensions that accounts for shear-induced particle migration," Phys. Fluids A 4, pp. 30-40, 1992.
11. P. R. Nott and J. F. Brady, "Pressure-driven suspension flow: simulation and theory," J. Fluid Mech., vol. 275, pp. 157-199, 1994.
12. J. F. Morris and J. F. Brady, "Pressure-driven flow of a suspension: buoyancy effects," Int. J. Multiphase Flow., vol. 24, no. 1, pp. 105-130, 1998.
13. H. Peng et al., "Underfilling fine pitch BGAs," IEEE Trans. Electron. Packag. Manufact., vol. 24;pp. 293-299, Oct. 2001.
14. T. Dory, K. Takahashi, T. Kume, J. Kubota, S. Seki, and T. Fujiyama, "Simultaneous chip-join and underfill assembly technology for flip-chip packaging," Intel Technol. J. Q3, 2000.
15. Fluid particle mechanics. University of Paisley, Paisley, U.K.. [Online]Available: http://www.cce.palsley, 1/fluid-particle-mechanics/PARTnd/partnd.html