Towards model-based engineering of underfill materials: CTE modeling

Microelectronics Journal

Volumn 32, Issue 4, 2001, Pages 331-338

  Vo, H T ^a   Todd, M ^b   Shi, F G ^a   Shapiro, A A ^a   Edwards, M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Dexter Electronic Materials   (United States)

Author keywords

Composite materials; Interphase characteristics; Thermal expansion coefficient modeling; Underfill materials characteristic

Indexed keywords

FLIP CHIP DEVICES; REINFORCED PLASTICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SOLDERING ALLOYS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE); UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0035311332     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00152-X     Document Type: Article

References (12)

1. Materials and mechanics issues in flip-chip organic packaging
2. Potential failure sites in a flip-chip package with and without underfill
3. Low-thermal expansion copper composites via negative CTE metallic elements
4. Impact of underfill filler particles on reliability of flip-chip interconects
5. Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
6. The scanning force microscope as a tool for the detection of local mechanical properties within the interphase of fibre reinforced polymers
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8. Elastic constants and thermal expansion of aluminum-SiC metal-matrix composites
9. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
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11. Mixed filler combinations for enhanced thermal conductivity of liquid encapsulants for electronic packaging
12. Thermal expansion behavior of silver matrix composites