Encapsulant materials for flip-chip attach

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1291-1297

  Gopalakrishnan, L ^a   Ranjan, M ^a   Sha, Y ^a   Srihari, K ^a   Woychik, C ^b  

^a State University of New York at Binghamton   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FILLERS; FLIP CHIP DEVICES; FRACTURE TOUGHNESS; GLASS TRANSITION; NETWORK COMPONENTS; PARTICLE SIZE; RELIABILITY; THERMAL EXPANSION; ENCAPSULATION; EPOXY RESINS; FLOW OF FLUIDS;

CRITICAL FACTORS; ENCAPSULANT MATERIALS; FILLER PARTICLES; FLIP CHIP ASSEMBLIES; FLOW CHARAC-TERISTICS; FLOW EXPERIMENTS; STAND OFF HEIGHT; UNDERFILL PROCESS;

ASSEMBLY; ELECTRONICS PACKAGING;

FLIP CHIP ASSEMBLY; UNDERFILL PROCESS;

EID: 0031636956     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678909     Document Type: Conference Paper

References (11)

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