Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs

Proceedings - Design Automation Conference

Volumn , Issue , 2004, Pages 181-184

  Jerke, Göran ^a   Lienig, Jens ^b   Scheible, Jürgen ^a  

^a ROBERT BOSCH GMBH   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Compaction; Decompaction; Electromigration; Interconnect reliability; Layout decomposition; Physical design

Indexed keywords

COMPACTION; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTROMIGRATION; METALLIZING; SIGNAL PROCESSING; TEMPERATURE DISTRIBUTION;

DECOMPACTION; INTERCONNECT RELIABILITY; LAYOUT DECOMPOSITION; PHYSICAL DESIGN;

INTEGRATED CIRCUIT LAYOUT;

EID: 4444233015     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/996566.996618     Document Type: Conference Paper

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