Improved bi-layer lift-off process for MEMS applications

Microelectronic Engineering

Volumn 85, Issue 5-6, 2008, Pages 1000-1003

  Liang, Jinxing ^a,b   Kohsaka, Fusao ^a   Matsuo, Takahiro ^a,b   Li, Xuefeng ^a   Ueda, Toshitsugu ^a  

^a WASEDA UNIVERSITY   (Japan)

^b Sakamoto Electric Mfg Co Ltd   (Japan)

Author keywords

3 D patterning; Lift off; MEMS; Two step development method; Undercut

Indexed keywords

COATED MATERIALS; DEPOSITION; ETCHING; MICROFABRICATION;

BI-LAYER LIFT-OFF PROCESS; TWO-STEP DEVELOPMENT METHOD;

MEMS;

EID: 44149112579     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.01.104     Document Type: Article

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