Mechanical behavior and thermal stability of nanocrystalline copper film prepared by gas deposition method

Scripta Materialia

Volumn 44, Issue 8-9, 2001, Pages 1547-1551

  Kobiyama, M ^a   Inami, T ^a   Okuda, S ^b  

^a IBARAKI UNIVERSITY   (Japan)

^b Tsukuba Institute of Science and Technology   (Japan)

Author keywords

Copper; Hardness test; Physical vapor deposition; Recrystallization and recovery

Indexed keywords

ANNEALING; COMPACTION; CONDENSATION; COPPER; FILM PREPARATION; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; METALLIC FILMS; POLYCRYSTALLINE MATERIALS; SCANNING TUNNELING MICROSCOPY; THERMODYNAMIC STABILITY; VAPOR DEPOSITION; X RAY CRYSTALLOGRAPHY;

GAS DEPOSITION METHOD; VICKERS HARDNESS TESTS;

NANOSTRUCTURED MATERIALS;

EID: 0035906736     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(01)00834-X     Document Type: Article

References (18)