Damage-free improvement of thickness uniformity of quartz crystal wafer by plasma chemical vaporization machining

CIRP Annals - Manufacturing Technology

Volumn 57, Issue 1, 2008, Pages 567-570

  Yamamura, K ^a   Shimada, S ^b   Mori, Y ^a  

^a OSAKA UNIVERSITY   (Japan)

^b OSAKA ELECTRO COMMUNICATION UNIVERSITY   (Japan)

Author keywords

Etching; Single crystal; Wafer

Indexed keywords

CHEMICAL FINISHING; ETCHING; QUARTZ; SINGLE CRYSTALS; THICKNESS MEASUREMENT; VAPORIZATION;

DICING; QUARTZ CRYSTAL WAFER; QUARTZ RESONATORS;

SILICON WAFERS;

EID: 43649093581     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2008.03.132     Document Type: Article

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