Thinning of silicon-on-insulator wafers by numerically controlled plasma chemical vaporization machining

Review of Scientific Instruments

Volumn 75, Issue 4, 2004, Pages 942-946

  Mori, Yuzo ^a   Yamamura, Kazuya ^a   Sano, Yasuhisa ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC RANDOM ACCESS STORAGE; ELLIPSOMETRY; MACHINING; PLASMA APPLICATIONS; PLASMA ETCHING; SILICON ON INSULATOR TECHNOLOGY; THICKNESS MEASUREMENT; ULTRATHIN FILMS; VAPORIZATION;

PLASMA CHEMICAL VAPORIZATION MACHINING; SILICON ON INSULATOR WAFERS; THINNING;

SILICON WAFERS;

EID: 2042540731     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1687041     Document Type: Article

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