Improvement of the thickness distribution of a quartz crystal wafer by numerically controlled plasma chemical vaporization machining

Review of Scientific Instruments

Volumn 76, Issue 9, 2005, Pages

  Shibahara, Masafumi ^a   Yamamura, Kazuya ^b   Sano, Yasuhisa ^b   Sugiyama, Tsuyoshi ^b   Endo, Katsuyoshi ^b   Mori, Yuzo ^b  

^a HYOGO PREFECTURAL INSTITUTE OF TECHNOLOGY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE PLASMA; ION KINETIC ENERGY; MACHINING PROCESSES; QUARTZ CRYSTAL WAFERS;

ATMOSPHERIC PRESSURE; CRYSTALS; KINETIC ENERGY; PLASMA APPLICATIONS; QUARTZ; VAPORIZATION;

MACHINING;

EID: 25844492510     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2041594     Document Type: Article

References (6)

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