The influence of temperature of three adhesive systems on bonding to ground enamel

Operative Dentistry

Volumn 33, Issue 3, 2008, Pages 272-281

  De Alexandre, Rodrigo Sversut ^a,c   Sundfeld, Renato H ^b   Giannini, Marcelo ^a   Lovadino, José Roberto ^a  

^a UNIVERSITY OF CAMPINAS   (Brazil)

^b SÃO PAULO STATE UNIVERSITY UNESP   (Brazil)

^c NONE   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

CLEARFIL SE BOND; INORGANIC COMPOUND; POLYMETHACRYLIC ACID DERIVATIVE; PRIME & BOND NT; PROMPT L POP; PROMPT L-POP; RESIN CEMENT; SILICON CARBIDE; SILICON DERIVATIVE; TOOTH CEMENT;

ANIMAL; ARTICLE; CATTLE; CHEMISTRY; COLD; DENTAL ACID ETCHING; DENTAL BONDING; ENAMEL; HEAT; MATERIALS TESTING; MECHANICAL STRESS; RANDOMIZATION; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; TEMPERATURE; TENSILE STRENGTH; ULTRASTRUCTURE;

ACID ETCHING, DENTAL; ANIMALS; CARBON COMPOUNDS, INORGANIC; CATTLE; COLD; DENTAL BONDING; DENTAL CEMENTS; DENTAL ENAMEL; HEAT; MATERIALS TESTING; MICROSCOPY, ELECTRON, SCANNING; POLYMETHACRYLIC ACIDS; RANDOM ALLOCATION; RESIN CEMENTS; SILICON COMPOUNDS; STRESS, MECHANICAL; SURFACE PROPERTIES; TEMPERATURE; TENSILE STRENGTH;

EID: 43449125888     PISSN: 03617734     EISSN: None     Source Type: Journal    
DOI: 10.2341/07-79     Document Type: Article

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