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Volumn 12, Issue 2, 2001, Pages 75-79

Effect of refrigeration on tensile bond strength of three adhesive systems.

Author keywords

[No Author keywords available]

Indexed keywords

BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; DENTIN BONDING AGENT; POLYMETHACRYLIC ACID DERIVATIVE; PRIME & BOND NT; RESIN; RESIN CEMENT; SCOTCHBOND MULTI PURPOSE; SCOTCHBOND MULTI-PURPOSE; SILICON DIOXIDE; SINGLE BOND; Z100 COMPOSITE RESIN; ZIRCONIUM;

EID: 0035223182     PISSN: 01036440     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (9)

References (0)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.