Temperature and humidity effects on bond strength of a dentinal adhesive

Operative Dentistry

Volumn 23, Issue 3, 1998, Pages 138-143

  Nystrom, G P ^a   Holtan, J R ^a   Phelps II, R A ^a,b   Becker, W S ^a   Anderson, T B ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b MILLSAPS COLLEGE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENTIN BONDING AGENT; RESIN; RESIN CEMENT; SCOTCHBOND MULTI PURPOSE; SCOTCHBOND MULTI-PURPOSE; SILICON DIOXIDE; Z100 COMPOSITE RESIN; ZIRCONIUM;

ARTICLE; CHEMISTRY; COMPARATIVE STUDY; DENTAL SURGERY; HUMAN; HUMIDITY; MATERIALS TESTING; METHODOLOGY; STATISTICAL ANALYSIS; TEMPERATURE; TENSILE STRENGTH;

COMPOSITE RESINS; DENTAL RESTORATION, PERMANENT; DENTIN-BONDING AGENTS; HUMANS; HUMIDITY; MATCHED-PAIR ANALYSIS; MATERIALS TESTING; RESIN CEMENTS; SILICON DIOXIDE; TEMPERATURE; TENSILE STRENGTH; ZIRCONIUM;

EID: 0032012034     PISSN: 03617734     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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