Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 182-185

  Yang, L Y ^a   Zhang, D H ^a   Li, C Y ^b   Liu, R ^c   Wee, A T S ^c   Foo, P D ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Barrier layer; Cu metallization; Thermal stability; Ultra low k

Indexed keywords

BARRIER LAYERS; CU METALLIZATION; ULTRA-LOW-Κ POROUS POLYMERS (ULKPP);

COPPER; DIFFUSION; INTERFACES (MATERIALS); METALLIZING; PERMITTIVITY; POROUS MATERIALS; SECONDARY ION MASS SPECTROMETRY; TANTALUM; THERMODYNAMIC STABILITY;

SEMICONDUCTING POLYMERS;

EID: 4344621093     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.071     Document Type: Article

References (7)

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