SCOPUS 정보 검색 플랫폼

Volumn 18, Issue 8, 2008, Pages 1173-1177

Fabrication of a memory chip by a complete self-assembly process using state-of-the-art multilevel cell (MLC) technology

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHIP SCALE PACKAGES; ELECTRON BEAMS; EVAPORATION; MOLECULAR ELECTRONICS; SELF ASSEMBLY;

MEMORY CHIPS; MOLECULAR DEVICES; MOLECULAR SWITCHES; MULTILEVEL CELL (MLC) TECHNOLOGY;

DATA STORAGE EQUIPMENT;

EID: 43249116142 PISSN: 1616301X EISSN: 16163028 Source Type: Journal
DOI: 10.1002/adfm.200700937 Document Type: Article

Times cited : (7)

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