THERMOMECHANICAL BEHAVIOR OF SOLDERED INTERCONNECTS FOR SURFACE MOUNTING: A COMPARISON OF THEORY AND EXPERIMENT.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1985, Pages 60-72

  Clatterbaugh, G V ^a   Charles Jr , H K ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS - TESTING; RELIABILITY - ANALYSIS;

HIGH-TEMPERATURE FATIGUE; LEADLESS CERAMIC CHIP CARRIERS (LCCC); POWER AND TEMPERATURE CYCLING; SOLDERED INTERCONNECTS THERMOMECHANICAL BEHAVIOR; SURFACE MOUNT ASSEMBLIES (SMA);

SOLDERING;

EID: 0022183096     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (26)