Re-calibration of engelmaier's model for leadless, lead-free solder attachments

Quality and Reliability Engineering International

Volumn 23, Issue 4, 2007, Pages 415-429

  Salmela, Olli ^a   Andersson, Klas ^b   Perttula, Altti ^b   Särkkà, Jussi ^a   Tammenmaa, Markku ^a  

^a NOKIA SIEMENS NETWORKS   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Engelmaier's model; Lead free solder; Reliability; Solder joint; Surface mount

Indexed keywords

BALL GRID ARRAYS; CALIBRATION; MATHEMATICAL MODELS; RELIABILITY; STATISTICAL METHODS;

ENGELMAIER'S MODEL; LEAD-FREE SOLDERS; SURFACE MOUNTS;

SOLDERED JOINTS;

EID: 34250628818     PISSN: 07488017     EISSN: 10991638     Source Type: Journal    
DOI: 10.1002/qre.810     Document Type: Article

References (16)

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