Fatigue of 60/40 Solder

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 9, Issue 4, 1986, Pages 423-432

  Solomon, Harvey D ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATERIALS TESTING - FATIGUE; STRAIN; THERMAL EFFECTS;

60/40 SOLDER; PLASTIC STRAIN/FATIGUE OF SOLDERS;

SOLDERS;

EID: 0022983573     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1986.1136672     Document Type: Article

References (17)

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3. H. D. Solomon, “Low cycle fatigue of 60/40 solder—Plastic strain limited vs. displacement limited testing,” in Proc. 2nd ASM Electronic Packaging Conf., J. A. Sartell, Ed., 1986.
4. —, “Low frequency, high temperature low cycle fatigue of solders,” presented at Conf. Low Cycle Fatigue—Directions for the Future, Lake George, NY. Sept. 30–Oct. 4, 1985. (Also GE Rep. 85CRD238, Dec. 1985.)
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8. S. S. Manson, “The challenge to unify treatment of high temperature fatigue—A partison proposal based on strain range partitioning,” in Proc. ASTM-STP 520. Philadelphia, PA: ASTM, 1973, pp. 744–782.
9. L. F. Coffin, Jr., “Fatigue at high temperature,” in Proc. ASTM-STP 520. Philadelphia, PA: ASTM, 1973, pp. 5–34.
10. R. N. Wild, “Fatigue properties of solder joints,” Welding J., vol. 51, pp. 521S–526S.
11. —, “Some fatigue properties of solders and solder joints,” presented at Internepcon, Brighton, England, 1975, (also IBM 742000481).
12. J. D. Morrow, “Cyclic plastic strain energy and fatigue of metals,” in ASTM-STP 378. Philadelphia, PA: ASTM, 1965, pp. 45–87.
13. H. D. Solomon, “Creep, strain rate sensitivity and low cycle fatigue of 60/40 solder,” to be published in Brazing and Soldering, no. 11, Autumn 1986.
14. —, “Frequency dependent low cycle fatigue crack propagation,” Met. Trans., vol. 4, pp. 341–347, 1972.
15. J. Oberschmidt, K. K. Kim, and D. Cypta, “Grain boundary diffusion in some Pb-Sn alloys,” J. Appl. Phys., vol. 53, pp. 5672–5677, 1982.
16. L. Zakraysek, D. E. Kelsey, and J. A. Devore, “Microstructure of solders,” presented at 9th Annu. Soldering Technology Seminar, Naval Weapons Center, China Lake, CA, Feb: 19–20, 1985.
17. D. Stone, S. P. Hanula, and C. Y. Li, “The effects of device and materials variables on the fatigue behavior of solder joints during the thermal cycle,” presented at the Electronics Components Conf., Washington, DC, 1985.