Metal migration in epoxy encapsulated ECL devices

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1323-1330

  Zhang, C ^a   Yalamanchili, P ^a   Al Sheikhley, M ^a   Christou, A ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL SCANNING ACOUSTIC MICROSCOPY (ESEM); MICROELECTRONIC PACKAGING TECHNOLOGY;

COPPER; DELAMINATION; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE (MECHANICAL); INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; STATISTICAL METHODS;

EMITTER COUPLED LOGIC CIRCUITS;

EID: 4544276374     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.021     Document Type: Conference Paper

References (5)

1. rd IEEE/IRPS Proc, 1985, pp.153-158.
2. Dixon, J.B., and Northrup, M.R., and Rooney, D.I., "Failure Analysis of a Hybrid Device Exhibiting Copper Dendrite Growth on Thick Film Resistors", Electronic Components and Technology Conf., 1991, pp. 109-114.
3. st IEEE/IRPS Proc, 1983, pp. 229-234.
4. Steppan, J.J., Roth, J. A., Hall, L.,C., Jeanette, D. A., and Carbone, S. P., "A Review of Corrosion Failure Mechanisms during Accelerated Tests", J. Electrochem. Soc. Vol. 134, No. 1, 1987, pp. 175-189.
5. th IEEE/IRPS Proc., 1982, pp. 27-33.