Peeling experiments of ductile thin films along ceramic substrates - Critical assessment of analytical models

International Journal of Solids and Structures

Volumn 45, Issue 13, 2008, Pages 3779-3792

  Wei, Yueguang ^a   Zhao, Haifeng ^a  

^a INSTITUTE OF MECHANICS   (China)

Author keywords

Analytical model; Interfacial fracture energy; Metal thin film; Peel experiment

Indexed keywords

ALUMINUM COMPOUNDS; CERAMIC MATERIALS; COPPER COMPOUNDS; DUCTILITY; PEELING;

INTERFACIAL FRACTURE ENERGY; METAL THIN FILM; PEEL EXPERIMENT;

THIN FILMS;

EID: 42649119464     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2007.10.023     Document Type: Article

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