Experimental measurements of the strain energy release rate for stiction-failed microcantilevers using a single-cantilever beam peel test

Journal of Microelectromechanical Systems

Volumn 16, Issue 1, 2007, Pages 38-43

  Leseman, Zayd C ^a   Carlson, Steven P ^a   Mackin, Thomas J ^b  

^a University of Illinois at Urbana Champaign   (United States)

^b CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

Author keywords

Cantilever; Peel test; Stiction; Strain energy

Indexed keywords

ADHESION; PIEZOELECTRIC ACTUATORS; POLYSILICON; STICTION; STRAIN ENERGY; STRAIN RATE;

MICROCANTILEVERS; PEEL TEST; STICTION FAILURES;

CANTILEVER BEAMS;

EID: 33947272066     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2006.883570     Document Type: Article

References (19)

1. T. Abe, W. Messner, and M. Reed, "Effective methods to prevent stiction during post-release-etch processing," in Proc. IEEE Micro Electro Mech. Syst. Conf., Amsterdam, The Netherlands, 1995, pp. 94-99.
2. R. Legtenberg, J. Elders, and M. Elwenspoek, "Stiction of surface microstructures after rinsing and drying: Model and investigation of adhesion mechanisms," in Proc. Transducers 93, 7th Int. Conf. Solid-State Sens. Actuators, Yokohoma, Japan, 1993, pp. 198-201.
3. R. Maboudian and R. T. Howe, "Critical review: Adhesion in surface micromechanical structures," J. Vacuum Sci. Technol. B, vol. 15, pp. 1-20, 1997.
4. C. H. Mastrangelo and C. H. Hsu, "A simple experimental technique for the measurement of the work of adhesion of microstructures," in Proc. Int. Workshop Solid-State Sens. Actuators, Hilton Head, SC, 1992, pp. 208-212.
5. C. H. Mastrangelo and C. H. Hsu, "Mechanical stability and adhesion of microstructures under capillary forces - Part I: Basic theory," J. Microelectromech. Syst., vol. 2, pp. 33-43, 1993.
6. C. H. Mastrangelo and C. H. Hsu, "Mechanical stability and adhesion of microstructures under capillary forces - Part II: Experiments," J. Microelectromech. Syst., vol. 2, pp. 44-55, 1993.
7. M. d. Boer and T. Michalske, "Accurate method for determining adhesion of cantilever beams," J. Appl. Phys., vol. 86, pp. 817-827, 1999.
8. E. Jones, M. Begley, and K. Murphy, "Adhesion of micro-cantilevers subjected to mechanical point-loading: Modeling and experiments," J. Mech. Phys. Solids, vol. 51, no. 8, pp. 1601-1622, 1993.
9. H. L. Ewalds and R. J. H. Wanhill, Fracture Mechanics. New York: Edward Arnold, 1993.
10. P. Davies, "Protocols for interlaminar fracture testing of composites," in Proc. Eur. Structural Integrity Soc. (ESIS) Polymer and Composites Track Group, Sep. 1993.
11. J. Rogers and L. Phinney, "Process yields for laser repair of aged, stiction-failed, mems devices," J. Microelectromech. Syst., vol. 10, pp. 280-285, 2001.
12. S. Timoshenko and J. M. Gere, Theory of Elastic Stability, 2nd ed. New York: McGraw-Hill, 1991.
13. S. Schennum, "An Experimental and Theoretical Investigation of Delamination Resistance in Glass Fiber Reinforced Polyestere Laminates," M.S. thesis, Univ. Illinois Urbana-Champaign, Urbana-Champaign, 1995.
14. J. J. Sniegowski and M. P. d. Boer, "Ic-compatible polysilicon surface micromachining," Annu. Rev. Mater. Sci., vol. 30, pp. 299-333, 2000.
15. J. Rogers, T. Mackin, and L. Phinney, "A thermomechanical model for adhesion reduction of MEMS cantilevers," J. Microelectromech. Syst., vol. 11, pp. 512-520, 2002.
16. D. Maier-Schneider, A. Koprululu, S. B. Holm, and E. Obermeier, "Elastic properties and microstructure of LPCVD polysilicon films," J. Micromech. Microeng., vol. 6, pp. 436-446, 1996.
17. G. Horn, T. Mackin, and J. Lesniak, "Trapped particle detection in bonded semiconductors using grey-field photoelastic imaging," Exper. Mechan., to be published.
18. R. A. Fisher, Statistical Methods for Research Workers, Thirteenth ed. Edinburgh, U.K.: Oliver and Boyd, 1958.
19. O. Raccurt, F. Tardif, F. A. d'Avitaya, and T. Vareine, "Influence of liquid surface tension on stiction of soi mems," J. Micromech. Microeng., vol. 14, pp. 1083-1090, 2004.