A new method for the micro-tensile testing of thin film

3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Volumn , Issue , 2008, Pages 112-115

  Liu, Rui ^a   Li, Xueping ^a   Wang, Hong ^a   Ding, Guifu ^a   Yang, Chunsheng ^a   Yang, Zhuoqing ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Mechanical properties; MEMS; Tensile testing; Thin film

Indexed keywords

METALS; MOLECULAR BEAM EPITAXY; NICKEL; SOLIDS; THICK FILMS; THIN FILM DEVICES; THIN FILMS; VAPOR DEPOSITION;

INTERNATIONAL CONFERENCES; LARGE STRAINS; MECHANICAL CHARACTERIZATIONS; MECHANICAL PROPERTIES; MEMS; METAL THIN FILMS; MOLECULAR SYSTEMS; PLASTIC YIELD; TENSILE STRUCTURES; THIN FILM; UNIAXIAL TENSIONS; YOUNG'S MODULUS;

TENSILE TESTING;

EID: 42549158096     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2008.4484298     Document Type: Conference Paper

References (7)

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