SCOPUS 정보 검색 플랫폼

Metals and Materials International

Volumn 3, Issue 2, 1997, Pages 130-136

Changes in the tensile strength and fracture mode with thickness of electrodeposited copper foil

(3) Yang, Jeom Shik a Kang, Soo Young b Lee, Dong Nyung c

a Iljin Copper Foil Co (South Korea)

b Daewoo Motor Co (South Korea)

c Seoul National University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; ELECTRODEPOSITION; ELECTRODES; FRACTURE; SULFUR COMPOUNDS;

ACID COPPER SULFATE; AVERAGE GRAIN SIZE; ELECTRODEPOSITED COPPER FOILS; ELECTRODEPOSITION CONDITIONS; FRACTURE STRAIN; HARDNESS DISTRIBUTION; INCLINED FRACTURE; TENSILE FRACTURES;

TENSILE STRENGTH;

EID: 0031460896 PISSN: 12259438 EISSN: None Source Type: Journal
DOI: 10.1007/bf03026137 Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.